반도체 제조공정 중 발생하는 오염입자 측정에 관한 연구

  • 나정길 (성균관대학교 기계공학부) ;
  • 김태성 (성균관대학교 기계공학부)
  • Published : 2006.05.01

Abstract

As the minimum feature size decreases, it is more difficult to control critical contaminant particles. For 16GB flash memory introduced by Samsung a few months ago, 50nm process was used and in this case, contaminant particles as small as 25nm should be control led. The particle beam mass spectrometer (PBMS) was developed to directly sample particles at pressures down to 100 mtorr. This instrument is sensitive to small particles (>5nm) produced in low concentrations ($>20cm^{-3}$). The PBMS has proved to be effect ive in measuring particles generated during semi-conductor fabrication processes, such as low-pressure chemical vapor deposition (LPCVD) of thin films. The operating principle of the PBMS and some measurement results are reviewed in this paper.

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