Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)
- 2006.04a
- /
- Pages.56-57
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- 2006
Improvement of Permeation of Solvent-free Multi-Layer Encapsulation of thin films on Ethylene Terephthalate(PET)
고분자 기판위에 유기 용매를 사용하지 않은 다층 박막 Encapsulation 기술 개발
- Kang, Hee-Jin (Yonsei Univ.) ;
- Han, Jin-Woo (Yonsei Univ.) ;
- Kim, Jong-Yeon (Yonsei Univ.) ;
- Moon, Hyun-Chan (Korea Electronics Technology Institute) ;
-
Choi, Sung-Ho
(Korea Electronics Technology Institute)
;
-
Park, Kwang-Bum
(Korea Electronics Technology Institute)
;
- Kim, Tae-Ha (Korea Electronics Technology Institute) ;
- Kim, Hwi-Woon (Bangjoo Optical Co.) ;
-
Seo, Dae-Shik
(Yonsei Univ.)
- 강희진 (연세대학교) ;
- 한진우 (연세대학교) ;
- 김종연 (연세대학교) ;
- 문현찬 (전자부품연구원) ;
-
최성호
(전자부품연구원)
;
-
박광범
(전자부품연구원)
;
- 김태하 (전자부품연구원) ;
- 김휘운 (방주광학) ;
-
서대식
(연세대학교)
- Published : 2006.04.28
Abstract
In this paper, the inorganic multi-layer thin film encapsulation was newly adopted to protect the organic layer from moisture and oxygen. Using the electron beam, Sputter, inorganic multi-layer thin-film encapsulation was deposited onto the Ethylene Terephthalate(PET) and their interface properties between inorganic and organic layer were investigated. In this investigation, the SiON SiO2 and parylene layer showed the most suitable properties. Under these conditions, the WVTR for PET can be reduced from a level of