한국전기전자재료학회:학술대회논문집 (Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference)
- 한국전기전자재료학회 2006년도 하계학술대회 논문집 Vol.7
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- Pages.567-568
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- 2006
슬러리 Modification 에 대한 연구
Methodological Study for Recycle of Chemical Mechanical Polishing Slurry
- Park, Sung-Woo (Daebul Univ.) ;
- Seo, Yong-Jin (Daebul Univ.) ;
- Lee, Woo-Sun (ChoSun Univ.)
- 발행 : 2006.06.22
초록
To investigate the recycle possibility of slurry for the oxide-chemical mechanical polishing (oxide-CMP) application, three kinds of retreated methods were introduced as follows: First, the effects on the addition of silica abrasives and the diluted silica slurry (DSS) on CMP performances were investigated. Second, the characteristics of mixed abrasive slurry (MAS) using non-annealed and annealed alumina (
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