Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)
- 2006.06a
- /
- Pages.212-213
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- 2006
Fabrication of polymer thick film resistor and study on resistance variation regarding curing temperature
폴리머 후막 저항체의 제작 및 경화 온도에 따른 저항 값 변화에 대한 연구
-
Yoo, Myong-Jae
(EM&PR center. Korea Electronics Technology Institute)
;
- Lee, Sang-Myong (EM&PR center. Korea Electronics Technology Institute) ;
-
Park, Seong-Dae
(EM&PR center. Korea Electronics Technology Institute)
;
- Kang, Nam-Kee (EM&PR center. Korea Electronics Technology Institute)
-
유명재
(전자소재패키징센터, 전자부품연구원)
;
- 이상명 (전자소재패키징센터, 전자부품연구원) ;
-
박성대
(전자소재패키징센터, 전자부품연구원)
;
- 강남기 (전자소재패키징센터, 전자부품연구원)
- Published : 2006.06.22
Abstract
Polymer thick film resistor paste was fabricated using various materials. Inorganic materials of carbon black and graphite were selected as fillers and epoxy resin was selected as organic material. Solvent with high boiling temperature was applied to adjust viscosity. A designed test coupon pattern was used to evaluate fabricated resistors. Aspect ratio of 1 was selected for evaluating resistor values. Electrical properties of fabricated resistors were measured and their values analyzed in relation to paste composition. PTF fabricated using carbon black as fillers achieved resistor value of