Proceedings of the KWS Conference (대한용접접합학회:학술대회논문집)
- 2006.05a
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- Pages.263-265
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- 2006
Dissolution Phenomenon of the Mixing Powder and Base Metal at TLP Bonding by Using the Base Metal Powder and Ni Base Filler Powder
모재분말과 Ni기 삽입금속의 혼합분말을 사용한 천이액상확산접합 시 혼합분말 및 모재의 용융현상
- Song U-Yeong ;
- Lee Bong-Geun ;
- Gang Jeong-Yun ;
- Ye Chang-Ho (Sermatech Korea. LTD.)
- Published : 2006.05.01
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