Thermal Behavior of Silver Paste to Improve Reliability and Image Quality of LCoS Panel

  • Chen, Yu-Hsien (Central Research Institute, Chunghwa Picture Tubes) ;
  • Huang, I-Chen (Central Research Institute, Chunghwa Picture Tubes) ;
  • Huang, Li-Chen (Central Research Institute, Chunghwa Picture Tubes) ;
  • Wang, Jiun-Ming (Central Research Institute, Chunghwa Picture Tubes) ;
  • Chen, Kun-Hong (Central Research Institute, Chunghwa Picture Tubes) ;
  • Liu, Kuang-Hua (Central Research Institute, Chunghwa Picture Tubes) ;
  • Li, Huai-An (Central Research Institute, Chunghwa Picture Tubes) ;
  • Lo, Yu-Cheng (Central Research Institute, Chunghwa Picture Tubes) ;
  • Liu, Pei-Yu (Central Research Institute, Chunghwa Picture Tubes)
  • Published : 2006.08.22

Abstract

Silver paste curing process is very important in LCoS panel manufacture because incomplete curing process will cause poor bonding strength and increase resistance. The imperfection situation results in poor reliability and the variation of the common voltage, respectively. The change of the common voltage causes image flicker. According to Kinetics, we acquire activation energy by using dynamic DSC and compare two kinds of silver paste. From the result of isothermal DSC, we get optimum curing parameters to solve the flicker problem caused of incomplete curing of the silver paste.

Keywords