A Study on Robust Design Optimization of Layered Plates Bonding Process Considering Uncertainties

적층판 결합공정의 불확정성을 고려한 강건최적설계

Design optimization of layered plates bonding process is conducted to achieve high product quality by considering uncertainties in a manufacturing process. During the cooling process of the sequential sub-processes, different thermal expansion coefficients lead to residual stress and displacement. thus resulting in defects on the surface of the adherent. So robust process optimization is performed to minimize the residual stress mean and variation of the assembly while constraining the distortion as well as the instantaneous maximum stress to the allowable limits. In robust process optimization, the dimension reduction (DR) method is employed to quantify both reliability and quality of the layered plate bonding. Using this method. the average and standard deviation is estimated. Response surface is constructed using the statistical data obtained by the DRM for robust objectives and constraints. from which the optimum solution is obtained.