Preparation and Properties Study of $Cu-MoSi_2$ Composites

  • Yi, Xiaoou (School of Materials Science and Technology, Huazhong University of Science and Technology) ;
  • Xiong, Weihao (School of Materials Science and Technology, Huazhong University of Science and Technology) ;
  • Li, Jian (College of Material Science and Engineering, Central South University)
  • Published : 2006.09.24

Abstract

The particulate strengthened $Cu-MoSi_2$ composites were prepared by a PM process to develop novel copper based composites with reasonable strength, high thermal conductivity and low thermal expansion coefficient. Microstructure of the composites was investigated by SEM; the tensile strength, elongation, thermal conductivity and thermal expansion coefficient (CTE) of the composites were examined. A comparative analysis of mechanical and thermal properties of various Cu-matrix composites currently in use was given and the strengthening mechanisms for the $Cu-MoSi_2$ composites were discussed.

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