Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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A Consideration of High Speed Signal Transmission in Clip Chip Carrier and Future Direction

  • Published : 2006.10.11
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Abstract

[ $\bullet$ ] Miniaturization of packaging size is a key for system performance. $\bullet$ Fundamental density increase of joint and carrier wiring are required in near future.

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