한국마이크로전자및패키징학회:학술대회논문집 (Proceedings of the International Microelectronics And Packaging Society Conference)
- 한국마이크로전자및패키징학회 2006년도 ISMP 2006
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- Pages.179-212
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- 2006
New Products for High Reliable Connections in Packaging Technology
초록
1.
키워드