한국마이크로전자및패키징학회:학술대회논문집 (Proceedings of the International Microelectronics And Packaging Society Conference)

한국마이크로전자및패키징학회 (The Korean Microelectronics and Packaging Society)
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3D Packaging : Where All Technologies Come Together

  • 발행 : 2006.02.01
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초록

[ $\bullet$ ] 3D is proliferating in all package types $\bullet$ Thin packages challenge all assembly technologies $\bullet$ Package assembly and test are closely coupled and design for testability is imperative to success

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