대한용접접합학회:학술대회논문집 (Proceedings of the KWS Conference)
- 대한용접접합학회 2005년도 춘계학술발표대회 개요집
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- Pages.31-33
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- 2005
BGA 패키지에서의 다양한 언더필의 신뢰성 평가
Reliability of Various Underfills on BGA package
초록
In this study, the interfacial reactions and electrical properties of the Sn-35(wt%)Pb-2(wt%)Ag/Cu BGA solder joints after the thermal shock test were investigated with three different kinds of the underfill used commercially. The microstructural evolutions of the solder joints were observed using a scanning electron microscopy (SEM) and the electrical resistance of the solder joints were evaluated with the numbers of thermal shock cycle using the four-prove method. The increase in the
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