Effect of Groove and Channel Size on the Thermal Transport Capacity of Micro-Capillary Pumped Loop for Mobile Electronic Device Cooling System

모바일 전자장비 냉각용 Micro-CPL내 형상크기변화에 따른 열성능 해석

As more high power wide band gap devices are being utilized. the thermal management issues associated with these devices need to be resolved. High power small devices dissipate excessive heat that must be cooled, but traditional cooling methods are insufficient to provide such a cooling means. This paper will evaluate a micro-capillary pumped loop thermal management system that is incorporated into the shim of the device, taking advantage of phase-change to increase the thermal conductivity of the system. The results of the modeling of the thermal management system will be discussed.