Proceedings of the IEEK Conference (대한전자공학회:학술대회논문집)
- 2005.11a
- /
- Pages.607-610
- /
- 2005
Thermal Stability Improvement of Ni Germanosilicide using Ni-Ta alloy for Nano-scale CMOS Technology
Nano-scale CMOS에 적용하기 위한 Ni-Ta 합금을 이용한 Ni-Germanosilicide의 열안정성 개선
- Kim, Yong-Jin (Dept. of Electronics Engineering, Chungnam National University) ;
- Oh, Soon-Young (Dept. of Electronics Engineering, Chungnam National University) ;
- Yun, Jang-Gn (Dept. of Electronics Engineering, Chungnam National University) ;
- Lee, Won-Jae (Dept. of Electronics Engineering, Chungnam National University) ;
- Agchbayar, Tuya (Dept. of Electronics Engineering, Chungnam National University) ;
- Ji, Hee-Hwan (Dept. of Electronics Engineering, Chungnam National University) ;
- Kim, Do-Woo (Dept. of Electronics Engineering, Chungnam National University) ;
- Heo, Sang-Bum (R&D center, MagnaChip Semiconductor) ;
- Cha, Han-Seob (R&D center, MagnaChip Semiconductor) ;
-
Kim, Young-Chul
(Dept. of Materials Engineering, Korea University of Technology and Education)
;
-
Lee, Hi-Deok
(Dept. of Electronics Engineering, Chungnam National University)
;
- Wang, Jin-Suk (Dept. of Electronics Engineering, Chungnam National University)
- 김용진 (충남대학교, 전자공학과) ;
- 오순영 (충남대학교, 전자공학과) ;
- 윤장근 (충남대학교, 전자공학과) ;
- 이원재 (충남대학교, 전자공학과) ;
- 아그츠바야르투야 (충남대학교, 전자공학과) ;
- 지희환 (충남대학교, 전자공학과) ;
- 김도우 (충남대학교, 전자공학과) ;
- 허상범 (매그너칩 반도체, R&D 센터) ;
- 차한섭 (매그너칩 반도체, R&D 센터) ;
-
김영철
(한국기술교육대학교, 신소재공학과)
;
-
이희덕
(충남대학교, 전자공학과)
;
- 왕진석 (충남대학교, 전자공학과)
- Published : 2005.11.26
Abstract
In this paper, Ni Germanosilicide using Ni-Ta/Co/TiN is proposed to improve thermal stability. The sheet resistance of Ni Germanosilicide utilizing pure Ni increased dramatically after the post-silicidation annealing at
Keywords