한국전기전자재료학회:학술대회논문집 (Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference)
- 한국전기전자재료학회 2005년도 하계학술대회 논문집 Vol.6
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- Pages.647-648
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- 2005
산화제 첨가에 따른 니켈 화학적 기계적 연마 특성 거동 연구
Study on Ni CMP Characteristics Behavior by Addition of Oxidizers
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Choi, Gwon-Woo
(Chosun Univ.)
;
- Kim, Nam-Hoon (Chosun Univ.) ;
- Seo, Yong-Jin (Daebul Univ.) ;
- Lee, Woo-Sun (Chosun Univ.)
- 발행 : 2005.07.07
초록
The development of CMP slurry chemistry for Ni that provides good CMP performance is the key for nickel based MEMS device fabrication. In this study, CMP of nickel was performed using different slurry versus oxidizer ratios arid different oxidizers also alumina particles as an abrasive.