한국전기전자재료학회:학술대회논문집 (Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference)
- 한국전기전자재료학회 2005년도 하계학술대회 논문집 Vol.6
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- Pages.311-312
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- 2005
경화 온도와 인쇄 공정 및 기판에 따른 폴리머 후막 저항체의 특성 변화에 대한 연구
Study on variation of electrical properties of polymer thick film resistor regarding curing temperature, printing process and substrate
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유명재
(전자소재패키징센터, 전자부품연구원) ;
- 이상명 (전자소재패키징센터, 전자부품연구원) ;
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박성대
(전자소재패키징센터, 전자부품연구원) ;
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이우성
(전자소재패키징센터, 전자부품연구원) ;
- 강남기 (전자소재패키징센터, 전자부품연구원)
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Yoo, Myong-Jae
(EM&PR center, Korea Electronics Technology Institute) ;
- Lee, Sang-Myong (EM&PR center, Korea Electronics Technology Institute) ;
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Park, Seong-Dae
(EM&PR center, Korea Electronics Technology Institute) ;
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Lee, Woo-Sung
(EM&PR center, Korea Electronics Technology Institute) ;
- Kang, Nam-Kee (EM&PR center, Korea Electronics Technology Institute)
- 발행 : 2005.07.07
초록
Applying a designed test coupon pattern for fabricating resistors various resistors were formed using PTF(polymer thick film) pastes. Aspect ratio from 0.25 to 4 were selected for fabricating resistors. Formed resistors were cured at