한국전기전자재료학회:학술대회논문집 (Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference)
- 한국전기전자재료학회 2005년도 하계학술대회 논문집 Vol.6
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- Pages.127-128
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- 2005
Semi-IPN 구조를 갖는 다이싱 테이프용 자외선 경화형 점착제의 경화거동
Curing Behaviors of SEMI-IPN Structure UV-curable Pressure Sensitive Adhesive for Dicing Tape
- Do, Hyun-Sung (Laboratory of Adhesion & Bio-Composites, Major in Environment Material Science, Seoul National Univ.) ;
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Kim, Hyun-Joong
(Laboratory of Adhesion & Bio-Composites, Major in Environment Material Science, Seoul National Univ.) ;
- Shim, Chang-Hoon (Ace Industries)
- 발행 : 2005.07.07
초록
UV-curable pressure sensitive adhesives were prepared by blending acrylic copolymer, copolymerized with butyl acrylate (BA), acrylic acid (AA) and vinyl acetate (VAc) by solution polymerization, triethyl amine (TEA) and trimethylolpropane triacrylate (TMPTA). The PSAs were evaluated by peel strength with varying contents of TMPTA and UV dose, and also glass transition temperature(