한국전기전자재료학회:학술대회논문집 (Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference)

한국전기전자재료학회 (The Korean Institute of Electrical and Electronic Material Engineers)
권호 표지

Semi-IPN 구조를 갖는 다이싱 테이프용 자외선 경화형 점착제의 경화거동

Curing Behaviors of SEMI-IPN Structure UV-curable Pressure Sensitive Adhesive for Dicing Tape

  • 도현성 (서울대학교 환경재료과학전공 바이오복합재료 및 접착과학연구실) ;
  • 김현중 (서울대학교 환경재료과학전공 바이오복합재료 및 접착과학연구실) ;
  • 심창훈 (에이스인더스트리(주))
  • Do, Hyun-Sung (Laboratory of Adhesion & Bio-Composites, Major in Environment Material Science, Seoul National Univ.) ;
  • Kim, Hyun-Joong (Laboratory of Adhesion & Bio-Composites, Major in Environment Material Science, Seoul National Univ.) ;
  • Shim, Chang-Hoon (Ace Industries)
  • 발행 : 2005.07.07
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초록

UV-curable pressure sensitive adhesives were prepared by blending acrylic copolymer, copolymerized with butyl acrylate (BA), acrylic acid (AA) and vinyl acetate (VAc) by solution polymerization, triethyl amine (TEA) and trimethylolpropane triacrylate (TMPTA). The PSAs were evaluated by peel strength with varying contents of TMPTA and UV dose, and also glass transition temperature($T_g$) of PSAs were measured. When exposed on UV irradiation, the PSAs showed the decreased peel strength and increased $T_g$. And following UV irradiation, the PSAs did not leave any residue on wafer after peel off PSA.

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