한국전기전자재료학회:학술대회논문집 (Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference)
- 한국전기전자재료학회 2005년도 하계학술대회 논문집 Vol.6
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- Pages.38-39
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- 2005
연마불균일도에 영향을 미치는 패드 표면특성에 관한 연구
The Effect of Pad Surface Characteristics on Within Wafer Non-uniformity in CMP
- 박기현 (부산대학교 정밀기계공학과) ;
- 박범영 (부산대학교 정밀기계공학과) ;
- 정재우 (부산대학교 정밀기계공학과) ;
- 이현섭 (부산대학교 정밀기계공학과) ;
- 정석훈 (부산대학교 정밀기계공학과) ;
- 정해도 (부산대학교 기계공학부) ;
- 김형재
- Park, Ki-Hyun (Department of Mechanical & Precision Engineering in PNU) ;
- Park, Boum-Young (Department of Mechanical & Precision Engineering in PNU) ;
- Jeong, Jae-Woo (Department of Mechanical & Precision Engineering in PNU) ;
- Lee, Hyun-Seop (Department of Mechanical & Precision Engineering in PNU) ;
- Jeong, Suk-Hoon (Department of Mechanical & Precision Engineering in PNU) ;
- Jeong, Hae-Do (School of Mechanical Engineering in PNU) ;
- Kim, Hyung-Ja (Department of mechanical engineering in Berkel)
- 발행 : 2005.07.07
초록
We have investigated the effect of the pad surface characteristics such as roughness, groove density and wear of pad on within wafer non-uniformity(WIWNU) in chemical mechanical polishing(CMP). We found that WIWNU increases as pad surface roughness(
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