Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)
- 2005.11a
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- Pages.366-367
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- 2005
Effect of Corrosion inhibitor, Benzotriazole (BTA), on Particle Adhesion in Cu CMP
Cu CMP중 BTA에 의한 Particle의 흡착에 관한 연구
- Song, Jae-Hoon (Division of Materials and Chemical Engineering, Hanyang University) ;
- Hong, Yi-Koan (Division of Materials and Chemical Engineering, Hanyang University) ;
- Kim, Tae-Gon (Division of Materials and Chemical Engineering, Hanyang University) ;
- Park, Jin-Goo (Division of Materials and Chemical Engineering, Hanyang University)
- Published : 2005.11.10
Abstract
The effect of benzotriazole (BTA) on the adhesion force of silica and pad particle on Cu/TEOS wafer surfaces was investigated with and without the addition of BTA. Cu-BTA had the isoelectric point (IEP) at around pH 4