Proceedings of the KIEE Conference (대한전기학회:학술대회논문집)
- 2005.11a
- /
- Pages.197-200
- /
- 2005
Analyses of incident ion energy and flux in plasma based surface treatment using a conducting grid
플라즈마 표면 처리시 전도성 그리드를 통한 표면 입사 이온 에너지와 입사량 증대에 관한 분석 및 그 응용
- Cho, Yong-Sung (Dept. of Electrical Engineering, Pusan National Univ.) ;
- Choi, Won-Young (Dept. of Electrical Engineering, Pusan National Univ.) ;
- Park, Hyun-Dong (Dept. of Electrical Engineering, Pusan National Univ.) ;
-
Choi, Joon-Young
(Dept. of Electrical Engineering, Pusan National Univ.)
;
-
Lee, Hae-June
(Dept. of Electrical Engineering, Pusan National Univ.)
;
-
Lee, Ho-Jun
(Dept. of Electrical Engineering, Pusan National Univ.)
;
-
Park, Chung-Hoo
(Dept. of Electrical Engineering, Pusan National Univ.)
- 조용성 (부산대학교 전기공학과) ;
- 최원영 (부산대학교 전기공학과) ;
- 박현동 (부산대학교 전기공학과) ;
-
최준영
(부산대학교 전기공학과)
;
-
이해준
(부산대학교 전기공학과)
;
-
이호준
(부산대학교 전기공학과)
;
-
박정후
(부산대학교 전기공학과)
- Published : 2005.11.04
Abstract
As Plasma Immersion ion Implantation (PIII) using a conducting grid is very useful to reduce the effect of capacitance and charging in surface modification. If the bias voltage applied to the conducting grid is in the range of hundreds of volts, the effects of surface charge and space charge substantially affect the incident ion energy and ion current to the surface. In this paper, through an 1d and a 2d PIC simulation the time varying formation of the space charge and surface charge is analyzed. Experiment with the optimally designed grid on the basis of the simulation results is conducted, and the results of both cases with grid and without grid are compared. In our work with Poly Urethane(PU), the improvement of adhesion is yielded by increasing surface roughness and decreasing Si component of PU.
Keywords