Proceedings of the KSME Conference (대한기계학회:학술대회논문집)
- 2005.11a
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- Pages.123.1-123.1
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- 2005
Finite Element Analysis of Multichip Package Clacks
멀티칩 패키지 균열의 유한요소 해석
- Park JeongSoon ;
- Lim Jae Hyuk ;
- Earmme Youn Young (KAIST) ;
- Im Seyoung (KAIST)
- Published : 2005.11.01