Proceedings of the KSME Conference (대한기계학회:학술대회논문집)
- 2005.11a
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- Pages.42.1-42.1
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- 2005
Effect of Flow Pattern on Wefer Temperature and Particle Behavior in the Baking Process of Manufacturing Semiconductors
반도체 베이킹 공정시 내부유동이 웨이퍼 온도와 입자거동에 미치는 영향
- Published : 2005.11.01