한국소성가공학회:학술대회논문집 (Proceedings of the Korean Society for Technology of Plasticity Conference)
- 한국소성가공학회 2005년도 추계학술대회 논문집
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- Pages.167-170
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- 2005
Diamond-like carbon 코팅기술을 사용한 UV-임프린트 스탬프 제작
Fabrication of UV imprint stamp using diamond-like carbon coating technology
- 정준호 (한국기계연구원 나노공정장비연구센터) ;
- 김기돈 (한국기계연구원 나노공정장비연구센터) ;
- 심영석 (한국기계연구원 나노공정장비연구센터) ;
- 최대근 (한국기계연구원 나노공정장비연구센터) ;
- 최준혁 (한국기계연구원 나노공정장비연구센터) ;
- 이응숙 (한국기계연구원 나노공정장비연구센터) ;
- 임태우 (한국과학기술원 기계공학과) ;
- 박상후 (한국과학기술원 기계공학과) ;
- 양동열 (한국과학기술원 기계공학과) ;
- 차남구 (한양대학교 재료화공학) ;
- 박진구 (한양대학교 재료화공학)
- JEONG JUN-HO (Nano-Mechanical Systems Research Center, Korea Institute of Machinery and Materials) ;
- KIM KI-DON (Nano-Mechanical Systems Research Center, Korea Institute of Machinery and Materials) ;
- SIM YOUNG-SUK (Nano-Mechanical Systems Research Center, Korea Institute of Machinery and Materials) ;
- CHOI DAE-GEUN (Nano-Mechanical Systems Research Center, Korea Institute of Machinery and Materials) ;
- CHOI JUNHYUK (Nano-Mechanical Systems Research Center, Korea Institute of Machinery and Materials) ;
- LEE EUNG-SUG (Nano-Mechanical Systems Research Center, Korea Institute of Machinery and Materials) ;
- LIM TAE-WOO (Department of Mechanical Engineering, Korea Advanced Institute of Science & Technology) ;
- PARK SANG-HU (Department of Mechanical Engineering, Korea Advanced Institute of Science & Technology) ;
- YANG DONG-YOL (Department of Mechanical Engineering, Korea Advanced Institute of Science & Technology) ;
- CHA NAM-GOO (Division of Materials and Chemical Engineering, Banyans University) ;
- PARK JIN-GOO (Division of Materials and Chemical Engineering, Banyans University)
- 발행 : 2005.10.01
초록
The two-dimensional (2D) and three-dimensional (3D) diamond-like carbon (DLC) stamps for ultraviolet nanoimprint lithography (UV-NIL) were fabricated using two kinds of methods, which were a DLC coating process followed by the focused ion beam (FIB) lithography and the two-photon polymerization (TPP) patterning followed by nano-scale thick DLC coating. We fabricated 70 nm deep lines with a width of 100 nm and 70 nm deep lines with a width of 150 nm on 100 nm thick DLC layers coated on quartz substrates using the FIB lithography. 200 nm wide lines, 3D rings with a diameter of
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