Proceedings of the KIEE Conference (대한전기학회:학술대회논문집)

The Korean Institute of Electrical Engineers (대한전기학회)
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Effects of Flip-chip interconnect elements on the transmission characteristics

플립칩 연결부 구성요소들이 전송특성에 미치는 영향

  • Lee, Jae-Hoon (Electrical and Computer Engineering, Sungkyunkwan University) ;
  • HwangBo, Hoon (Electrical and Computer Engineering, Sungkyunkwan University) ;
  • Nah, Wan-Soo (Electrical and Computer Engineering, Sungkyunkwan University) ;
  • Joo, Jin-Ho (Electrical and Computer Engineering, Sungkyunkwan University) ;
  • Jung, Seung-Boo (Electrical and Computer Engineering, Sungkyunkwan University)
  • 이재훈 (성균관대학교 전기전자 및 컴퓨터공학과) ;
  • 황보훈 (성균관대학교 전기전자 및 컴퓨터공학과) ;
  • 나완수 (성균관대학교 전기전자 및 컴퓨터공학과) ;
  • 주진호 (성균관대학교 전기전자 및 컴퓨터공학과) ;
  • 정승부 (성균관대학교 전기전자 및 컴퓨터공학과)
  • Published : 2005.07.18
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Abstract

In this paper, we analyzed the effect of flip chip interconnect which is a part of FC-BGA package on the transmission characteristics of interconnect. We designed simple interconnect model and analyzed the change of the transmission characteristics as the size of each component change. And we provided design guide of interconnect which shows more enhanced results.

Keywords