ESPI를 이용한 엔지니어링 플라스틱 열 변형 분석

Recently, various plastics are used for improvement of reliability and thermal stability of electronic goods. But, it is difficult to choose suitable balance of grade resin to each other product property. Selection of high efficiency resin is becoming inescapable circumstance according to change of reflow temperature of product and development of product following to lead free. Using a inexpensive and reasonable resin, that sustain a uniform performance of product quality. It is make a robust product and increase a company's competitive power. Hereupon, I introduce example that use ESPI methods of thermal deformation analysis of product using in our company product. I try to refer to a structural weak point detection of real time measurement of electronic parts instead of mechanical and chemical measurement of specimen type.