Proceedings of the Korean Institute of Communication Sciences Conference (한국통신학회:학술대회논문집)

The Korean Institute of Commucations and Information Sciences (한국통신학회)
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High Frequency Characterization of Chip Package for High Speed Wireless Communication Systems

무선 통신용 고속 소자 패키지의 고주파 특성

  • Kim Joon Il (Department of Electronic Engineering, Sogang University) ;
  • Choi Soon Shin (Department of Electronic Engineering, Sogang University) ;
  • Jee Yong (Department of Electronic Engineering, Sogang University)
  • 김준일 (서강대학교 전자공학과) ;
  • 최순신 (서강대학교 전자공학과) ;
  • 지용 (서강대학교 전자공학과)
  • Published : 2004.11.01
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