Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference (한국윤활학회:학술대회논문집)

Korean Tribology Society (한국트라이볼로지학회)
권호 표지

Average Flow Model with Elastic Deformation for CMP

화학적 기계 연마를 위한 탄성변형을 고려한 평균유동모델

  • Kim Tae-Wan (Research Institute of Mechanical Technology, Pusan National University) ;
  • Lee Sang-Don (Graduate School, Precision and Mechanical Engineering, Pusan National University) ;
  • Cho Yong-Joo (School of Mechanical Engineering, Pusan National University)
  • 김태완 (부산대학교 기계기술연구소) ;
  • 이상돈 (부산대학교 정밀기계공학과 대학원) ;
  • 조용주 (부산대학교 기계공학부)
  • Published : 2004.11.01
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Abstract

We present a three-dimensional average flow model considering elastic deformation of pad asperities for chemical mechanical planarization. To consider the contact deformation of pad asperities in the calculation of the flow factor, three-dimensional contact analysis of a semi-infinite solid based on the use of influence functions is conducted from computer generated three dimensional roughness data. The average Reynolds equation and the boundary condition of both force and momentum balance are used to investigate the effect of pad roughness and external pressure conditions on film thickness and wafer position angle.

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