한국전기전자재료학회:학술대회논문집 (Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference)
- 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.2
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- Pages.1288-1291
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- 2004
구리 CMP시 비이온 계면활성제의 알루리마 슬러리 안정성에 대한 효과
Characteristics by Surfactant Condition at Copper CMP
- Lee, Do-Won (Chung-Ang University) ;
- Kim, Nam-Hoon (Chung-Ang University) ;
- Kim, Sang-Yong (Dongbu-Anam Semiconductor) ;
- Seo, Yong-Jin (Daebul University) ;
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Chang, Eui-Goo
(Chung-Ang University)
- 발행 : 2004.07.05
초록
In this study, physical characteristics of alumina slurry on variation of pH value and the effect of non-ionic surfactants on alumina slurry for copper chemical mechanical planarization (CMP) slurry have been investigated. After pH value of the slurry with alumina abrasive was changed by adding various amount of
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