한국전기전자재료학회:학술대회논문집 (Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference)
- 한국전기전자재료학회 2004년도 추계학술대회 논문집 Vol.17
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- Pages.719-722
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- 2004
강유전체막의 CMP 특성
Chemical Mechanical Polishing (CMP) Characteristics of Ferroelectric BST Thin Film
- Park, Sung-Woo (Daebul University) ;
- Kim, Nam-Hoom (Chosun University) ;
- Lee, Woo-Sun (Chosun University) ;
- Seo, Yong-Jin (Daebul University)
- 발행 : 2004.11.11
초록
In this work, we applied the chemical mechanical polishing (CMP) process to the planarization of ferroelectric film. We compared the structural characteristics of BST