Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)
- 2004.11a
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- Pages.719-722
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- 2004
Chemical Mechanical Polishing (CMP) Characteristics of Ferroelectric BST Thin Film
강유전체막의 CMP 특성
- Park, Sung-Woo (Daebul University) ;
- Kim, Nam-Hoom (Chosun University) ;
- Lee, Woo-Sun (Chosun University) ;
- Seo, Yong-Jin (Daebul University)
- Published : 2004.11.11
Abstract
In this work, we applied the chemical mechanical polishing (CMP) process to the planarization of ferroelectric film. We compared the structural characteristics of BST