Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)
- 2004.07a
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- Pages.256-259
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- 2004
R&D CMP SOLUTION
Abstract
Chemical mechanical polishing(CMP) has been adopted in processing semiconductors for more than ten years. Although some customers expressed negative opinion about CMP at the beginning of its appearance, CMP has currently been applied to a variety of fields in addition to semiconductor multi-layer wiring strategies. This report summarizes each sort of CMP skills in their development stage and introduces each type of MAT's machines optimized for CMP research and development
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