한국신뢰성학회:학술대회논문집 (Proceedings of the Korean Reliability Society Conference)
- 한국신뢰성학회 2004년도 정기학술대회
- /
- Pages.221-226
- /
- 2004
가속 시험을 통한 솔더조인트의 건전성 평가
초록
The thermal stresses induced by difference in Coefficient of Thermal Expansion between FR-4 board and 63Sn-37Pb solder joint directly affect the reliability of 63Sn-37Pb solder joint. This research, thus, focuses to investigate the crack initiation and propagation behavior around solder joint by imposing a designed Acceleration Life Test Procedure on solder joint by using a newly manufactured Thermal Impact Experimental Apparatus. The fracture mechanism of the solder joint was found to be highly influenced by thermal stresses. The reliability of solder joint was evaluated by using a failure probability model in terms of varying parameters such as frequency and temperature. The relationship between failure probability and safety factor was also studied.
키워드