Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)
- 2004.11a
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- Pages.23-23
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- 2004
(Improvement in Warpage of Heterogeneous LTCC Substrate by Process Conditions)
공정조건을 통한 이종 LTCC 기판의 휨 현상 개선
Abstract
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