한국마이크로전자및패키징학회:학술대회논문집 (Proceedings of the International Microelectronics And Packaging Society Conference)
- 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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- Pages.243-255
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- 2004
Pre-applied Underfill Technology
- Todd Michael (Henkel Loctite) ;
- Tang Hao (Henkel Corporation) ;
- Shi Gary (Henkel Corporation) ;
- Crane Larry (Henkel Corporation) ;
- Carson George (Henkel Corporation)
- 발행 : 2004.09.01