Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)
- 2003.05b
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- Pages.31-34
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- 2003
A Study on the chemical-mechanical polishing process of Sapphire Wafers for GaN thin film growth.
사파이어웨이퍼의 기계-화학적인 연마 가공특성에 관한 연구
- Nam, Jung-Hwan (Chonbuk Univ.) ;
- Hwang, Sung-Won (Chonbuk Univ.) ;
- Shin, Gwi-Su (Chonbuk Univ.) ;
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Kim, Keun-Joo
(Chonbuk Univ.) ;
- Suh, Nam-Sup (Chonbuk Univ.)
- Published : 2003.05.16
Abstract
The sapphire wafers for blue light emitting devices were manufactured by the implementation of the surface machining technology based on micro-tribology. This process has been performed by chemical and mechanical polishing(CMP) process. The sapphire crystalline wafers were characterized by double crystal X-ray diffraction. The sample quality of sapphire crystalline wafer at surfaces has a full width at half maximum 89 arcses. The surfaces of sapphire wafers were mechanically affected by residual stress and surface default. Sapphire wafers's waveness has higher abrasion rate in the edge of the wafer than its center due to Newton's Ring interference.