한국전기전자재료학회:학술대회논문집 (Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference)
- 한국전기전자재료학회 2003년도 춘계학술대회 논문집 센서 박막재료 반도체 세라믹
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- Pages.166-169
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- 2003
구리 CMP 공정시 계면활성제 첨가 조건에 의한 슬러리 특성
Slurry Characteristics by Surfactant Condition at Copper CMP
- Kim, In-Pyo (Chung-Ang University) ;
- Kim, Nam-Hoon (Chung-Ang University) ;
- Lim, Jong-Heun (Dong-Jin Semichem) ;
- Kim, Sang-Yong (Dongbu-Anam Semiconductor) ;
- Kim, Tae-Hyoung (Yeo-Joo College) ;
- Chang, Eui-Goo (Chung-Ang University)
- 발행 : 2003.05.16
초록
In this study, we evaluated the characteristics by the addition of 3 different kinds of nonionic surfactant to improve the dispersion stability of slurries. Slurry stability is an issue in any industry in which settling of particles can result in poor performance. So we observed the variation of particle size and settling rate when the concentration and addition time of surfactant are changed. When the surfactant is added after milling process, the particle size and pH became low. It is supposed that the particle agglomeration was disturbed by adsorption of surfactant on alumina abrasive. The settling rate was relatively stable when nonionic surfactant is added about 0.1~1.0 wt%. When molecular weight(MW) is too small like Brij 35, it was appeared low effect on dispersion stability. Because it can't prevent coagulation and subsequent settling with too small MW. The proper quality of MW for slurry stability was presented about 500,000. Consequently, the addition of nonionic surfactant to alumina slurry has been shown to have very good effect on slurry stabilization. If we apply this results to copper CMP process, it is thought that we will be able to obtain better yield.