Proceedings of the Korean Society of Broadcast Engineers Conference (한국방송∙미디어공학회:학술대회논문집)
- 2003.11a
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- Pages.69-72
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- 2003
An Implementation of Highly Integrated Signal Processing IC for HDTV
- Hahm Cheul-Hee (Home Solution Lab., Digital Media R&D Center, Samsung Electronics Co., Ltd.) ;
- Park Kon-Kyu (Home Solution Lab., Digital Media R&D Center, Samsung Electronics Co., Ltd.) ;
- Kim Hyoung-Gil (Home Solution Lab., Digital Media R&D Center, Samsung Electronics Co., Ltd.) ;
- Jung Choon-Sik (Home Solution Lab., Digital Media R&D Center, Samsung Electronics Co., Ltd.) ;
- Lee Sang-keun (Home Solution Lab., Digital Media R&D Center, Samsung Electronics Co., Ltd.) ;
- Jang Jae-Young (D-TV P/J Team, SoC R&D Center, Samsung Electronics Co., Ltd.) ;
- Park Sung-Uk (D-TV P/J Team, SoC R&D Center, Samsung Electronics Co., Ltd.) ;
- Chon Byung-Hoan (D-TV P/J Team, SoC R&D Center, Samsung Electronics Co., Ltd.) ;
- Chun Kang-Wook (Home Solution Lab., Digital Media R&D Center, Samsung Electronics Co., Ltd.) ;
- Jo Jae-Moon (Home Solution Lab., Digital Media R&D Center, Samsung Electronics Co., Ltd.) ;
- Song Dong-il (Home Solution Lab., Digital Media R&D Center, Samsung Electronics Co., Ltd.)
- Published : 2003.11.01
Abstract
This paper presents a signal processing IC for digital HDTV, which is designed to operate in bunt-in HDW or in HD-set-top Box. The chip supports de-multiplexing an ISO/IEC 13818-1 MPEG-2 TS stream. It decodes MPEG-2 MP@HL video bitstream, and provides high-quality scaled video for display on HDTV monitor. The chip consists of ARM7TDMI for TS-Demux, PCI interface, Audio interface, MPEG2 MP@HL video decoder Display processor, Graphic processor, Memory controller, Audio int3face, Smart Card interface and UART. It is fabricated using Sam sung's 0.18-um and the package of 492-pin BGA is used.
Keywords