대한전기학회:학술대회논문집 (Proceedings of the KIEE Conference)
- 대한전기학회 2003년도 학술회의 논문집 정보 및 제어부문 A
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- Pages.291-294
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- 2003
Laser 거리센서를 이용한 PCB에서의 납 도포상태검사
Solder Paste Inspection of PCB using Laser Sensor
- 발행 : 2003.11.21
초록
In this paper, 2D and 3D inspection algorithm for printed solder on PCB is introduced. The aim of inspection is the detection of error such as rich solder poor solder and missing solder. For Inspection, laser distance sensor is used. For 2D inspection, laser image that is created by normalizing laser data between 0 and 255 are used. Reference Image is made using gerber file. Image processing algorithm is used for 2D inspection. By adding thickness of metal stencil to laser image, volume for solder can be calculated and 3D inspection is carried out.