반도체 Package 용 Seam Seal Welding System 개발

  • 이우영 (한국기술교육대 기계공학부) ;
  • 진경복 (한국기술교육대 제어시스템공학과) ;
  • 오자환 (한국기술교육대 제어시스템공학과 대학원) ;
  • 김경수 ((주)미테크노 기술연구소)
  • 발행 : 2003.05.01

초록

Seam seal welding on the semi-conductor package is a process for sealing the packages of semiconductors, crystal parts, saw filters, oscillators with lid plate by seam welding. This paper present the development process of automatic seam seal welding system. In this process, the process algorithm, high precision welding current control, design of welding head, high speed and high precision feeding mechanism, user interface process control program technologies are included.

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