한국정밀공학회:학술대회논문집 (Proceedings of the Korean Society of Precision Engineering Conference)
- 한국정밀공학회 2003년도 춘계학술대회 논문집
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- Pages.1059-1062
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- 2003
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- 2005-8446(pISSN)
ESPI 기법을 이용한 동 박막의 인장 특성 측정
Measurement of Tensile Properties of Copper foil using ESPI technique
초록
Micro-tensile testing system has been developed and micro-tensile tests for copper foil have been carried out. The system consisted of a micro tensile loading system and a micro-ESPI system for measuring strain. The loading system has a maximum loading capacity of 50N and a stroke resolution of 4.5nm. Stress-strain curves for the electro-deposited copper foil with the thickness of 18