A CMOS IC-Card Interface Chipset

CMOS IC-카드 인터페이스 칩셋

  • 오원석 (전자부품연구원 SoC 연구센터) ;
  • 이성철 (전자부품연구원 SoC 연구센터) ;
  • 이승은 (전자부품연구원 SoC 연구센터) ;
  • 최종찬 (전자부품연구원 SoC 연구센터)
  • Published : 2003.07.01

Abstract

For proper communication with various types of IC-Card, multiple IC-Card interface complying with the IC-Card standard (ISO7816) is embedded and realized as a peripheral on the 32-bit RISC based system-on-a-chip. It provides the generation of either 3.3V or 5V power supply for the operation of the inserted IC-Card as well. IC-Card interface is divided into an analog front-end (AFE) and a digital back-end (DBE). The embedded DC-DC converters suitable for driving IC-Cards are incorporated in the AFE. The chip design for multiple IC-Card interface is implemented on a standard 0.35${\mu}{\textrm}{m}$ triple-metal double-poly CMOS process and is packaged in a 352-pin plastic ball grid array (PBGA). The total gate count is about 400,000, excluding the internal memory. Die area is 7890${\mu}{\textrm}{m}$ $\times$ 7890${\mu}{\textrm}{m}$.

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