Semiconductor Wafer Cleaning and PR Strip Processes using Ozone

오존을 이용한 반도체 웨이퍼 세정 및 PR 제거 공정

This paper has been studied on wafer cleaning and photoresist striping in semiconductor fabrication processes using ozone solved deionized water. In this work, we have developed high concentration ozone generating system and high contact ratio ozone solving system to get high efficiency DIO$_3$. Through this study, we obtained 11% ozone gas concentration, 99.5% of ozone efficiency and 51% of solubility in deionized water.