Proceedings of the KWS Conference (대한용접접합학회:학술대회논문집)
- 2003.05a
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- Pages.199-200
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- 2003
A study on reliability of electroless Ni-P UBM layer as variation of P content and Sn-3.5Ag solder in BGA joints
P함량에 따른 무전해 Ni-P UBM층과 Sn-3.5Ag솔더의 BGA접합부 신뢰성에 관한 연구
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