Development of joining process of the BSCCO(2223)/Ag multi-filament tapes

BSCCO(2223)/Ag 다심 초전도선재의 접합공정 개발

  • Kim, Kyu-Tae (School of Matallurgical and Materials Engineering, Sungkyunkwan University) ;
  • Kim, Jung-Ho (School of Matallurgical and Materials Engineering, Sungkyunkwan University) ;
  • An, Hyuck (School of Matallurgical and Materials Engineering, Sungkyunkwan University) ;
  • Jang, Seok-Hern (School of Matallurgical and Materials Engineering, Sungkyunkwan University) ;
  • Joo, Jin-Ho (School of Matallurgical and Materials Engineering, Sungkyunkwan University)
  • 김규태 (성균관대학교 금속재료공학부) ;
  • 김정호 (성균관대학교 금속재료공학부) ;
  • 안혁 (성균관대학교 금속재료공학부) ;
  • 장석헌 (성균관대학교 금속재료공학부) ;
  • 주진호 (성균관대학교 금속재료공학부)
  • Published : 2003.02.01

Abstract

We jointed Bi(Pb)-Sr-Ca-Cu-O multifilament tapes and evaluated their electrical properties. In order to improve connectivity of multifilarnents, single-filament tape was inserted between two multifilament tapes or multifilament was stepped by mechanical remove. The critical current ratio (CCR) and n-value of the jointed tapes were evaluated as a function of uniaxial pressure. It was observed that CCR and n-value were 24.8-29.0% and 2.5-2.8 for lap-jointed tape. On the other hand, the corresponding values were improved to 51.8-61.9% and 2.9-5.1 for three stepped jointed tape, and 63.4-67.9% and 3.4-4.2 for double MSM lap-jointed tape, respectively. These improvements are to be due to better interconnection between filaments of two tapes.

Keywords