Proceedings of the Korea Institute of Applied Superconductivity and Cryogenics Conference (한국초전도저온공학회:학술대회논문집)
- 2003.02a
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- Pages.120-122
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- 2003
Development of joining process of the BSCCO(2223)/Ag multi-filament tapes
BSCCO(2223)/Ag 다심 초전도선재의 접합공정 개발
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Kim, Kyu-Tae
(School of Matallurgical and Materials Engineering, Sungkyunkwan University) ;
- Kim, Jung-Ho (School of Matallurgical and Materials Engineering, Sungkyunkwan University) ;
- An, Hyuck (School of Matallurgical and Materials Engineering, Sungkyunkwan University) ;
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Jang, Seok-Hern
(School of Matallurgical and Materials Engineering, Sungkyunkwan University) ;
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Joo, Jin-Ho
(School of Matallurgical and Materials Engineering, Sungkyunkwan University)
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김규태
(성균관대학교 금속재료공학부) ;
- 김정호 (성균관대학교 금속재료공학부) ;
- 안혁 (성균관대학교 금속재료공학부) ;
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장석헌
(성균관대학교 금속재료공학부) ;
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주진호
(성균관대학교 금속재료공학부)
- Published : 2003.02.01
Abstract
We jointed Bi(Pb)-Sr-Ca-Cu-O multifilament tapes and evaluated their electrical properties. In order to improve connectivity of multifilarnents, single-filament tape was inserted between two multifilament tapes or multifilament was stepped by mechanical remove. The critical current ratio (CCR) and n-value of the jointed tapes were evaluated as a function of uniaxial pressure. It was observed that CCR and n-value were 24.8-29.0% and 2.5-2.8 for lap-jointed tape. On the other hand, the corresponding values were improved to 51.8-61.9% and 2.9-5.1 for three stepped jointed tape, and 63.4-67.9% and 3.4-4.2 for double MSM lap-jointed tape, respectively. These improvements are to be due to better interconnection between filaments of two tapes.
Keywords