한국마이크로전자및패키징학회:학술대회논문집 (Proceedings of the International Microelectronics And Packaging Society Conference)
- 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
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- Pages.270-277
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- 2003
Sn-3.5Ag 솔더를 이용한 페리퍼럴 어레이 플립칩의 열 성능 분석
초록
Thermal performance of flip chip bonding with Sn-3.5Ag solder ball was studied. The temperature distribution was measured with IR(InfraRed) camera of 25 urn resolution. The measurement shows that most of the samples had much higher maximum temperature than average temperature. With central heater and 2.5 (W), the difference between maximum and average temperature is over
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