Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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Wafer cleaning efficiency by Laser Shock Wave

레이저충격파를 이용한 웨이퍼 세정

  • Kang Y. J. (Department of Metallurgy and Materials Engineering, Hanyang University) ;
  • Lee S. H. (Department of Metallurgy and Materials Engineering, Hanyang University) ;
  • Park J. G. (Department of Metallurgy and Materials Engineering, Hanyang University) ;
  • Lee J. M. (Laser Engineering Group, IMT Co. Ltd.) ;
  • Kim T. H. (Laser Engineering Group, IMT Co. Ltd.)
  • Published : 2003.11.01
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Abstract

To develop cleaning process various particles should be deposited on wafer surfaces to measure particle removal efficiencies. The purpose of the article in to evaluate, removal efficient)r of silica and alumina particles from wafer surfaces when they are deposited by dry and wet method. Dry deposition in air and wet spray deposition using solutions are used. van der Waals are considered to calculate the adhesion force of particles on surfaces. Higher adhesion force is measured on alumina particles on silicon when particles are deposited in air.

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