Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)
- 2003.11a
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- Pages.21-21
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- 2003
The Development of NiPd Alloy42 Leadframe Package and the Results of Reliability Test
Alloy42 Base Leadframe용 NiPd Package 개발 및 조립 신뢰성 평가 결과
Abstract
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