한국마이크로전자및패키징학회:학술대회논문집 (Proceedings of the International Microelectronics And Packaging Society Conference)
- 한국마이크로전자및패키징학회 2003년도 국제표면실장 및 인쇄회로기판 생산기자재전:전자패키지기술세미나
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- Pages.1-19
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- 2003
A Case Study of Lead-free Thick Film Conductors with Lead-containing and Lead-free Solders
- 유연수 (헤라우스 오리엔탈 하이텍) ;
- ;
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- Yu Yeon Su ;
- Bokalo Peter (Heraeus Inc. Circuit Material Division) ;
- Shahbazi Samson (Heraeus Inc. Circuit Material Division) ;
- Matier Colleen (Heraeus Inc. Circuit Material Division)
- 발행 : 2003.04.01
초록
The electronic market thrust for many hybrid circuit manufacturers is changing because commercial market segments such as telecommunications, automotive and consumer electronics have increased the demand world wide for environmentally friendly thick film products. This, in turn, places a stronger emphasis on the material suppliers within the circuit fabrication industry to provide toxin free products with equal or higher performance than traditional technology. A new group of silver based thick film conductors, which are totally free of such toxins as cadmium, nickel and Bead have been developed to meet new environmental requirements. Traditional thick film products and newly developed toxin free compositions will be compared and data will be presented. To evaluate their performance, both groups of conductors were tested for solder acceptance, leach resistance and aged adhesion with standard lead-containing solder and higher temperature lead-free solder.
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