한국윤활학회:학술대회논문집 (Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference)
- 한국윤활학회 2002년도 proceedings of the second asia international conference on tribology
- /
- Pages.445-446
- /
- 2002
The Effect of Mechanical Properties of Polishing Pads on Oxide CMP ( Chemical Mechanical Planarization )
- Hong, Yi-Koan (Department of Metallurgy and Materials Engineering, Hanyang University) ;
- Eom, Dae-Hong (Department of Metallurgy and Materials Engineering, Hanyang University) ;
- Kang, Young-Jae (Department of Metallurgy and Materials Engineering, Hanyang University) ;
- Park, Jin-Goo (Department of Metallurgy and Materials Engineering, Hanyang University) ;
- Kim, Jae-Suk (SKC Co.) ;
- Kim, Geon (SKC Co.) ;
- Lee, Ju-Yeol (SKC Co.) ;
- Park, In-Ha (SKC Co.)
- 발행 : 2002.10.21
초록
The purpose of this study was to investigate the effect of micro holes, pattern structure and elastic modulus of pads on the polishing behavior such as the removal rate and WIWNU (within wafer non-uniformity) during CMP. The regular holes on the pad act as the superior abrasive particle's reservoir and regular distributor at the bulk pad, respectively. The superior CMP performance was observed at the laser processed bulk pad with holes. Also, th ε groove pattern shape was very important for the effective polishing. Wave grooved pad showed higher removal rates than K-grooved pad. The removal rate was linearly increased as the top pad's elastic modulus increased.