한국정보디스플레이학회:학술대회논문집
- 한국정보디스플레이학회 2002년도 International Meeting on Information Display
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- Pages.275-278
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- 2002
Low resistance and low temperature bonding between Silver and Indium
- Cho, Sung-Il (Center for Electronic Packaging Materials, Department of Materials Science and Engineering, Korea Advanced Institute of Science and technology) ;
- Yu, Jin (Center for Electronic Packaging Materials, Department of Materials Science and Engineering, Korea Advanced Institute of Science and technology) ;
- Kim, Young-Ho (Center for Electronic Packaging Materials, Department of Materials Science and Engineering, Korea Advanced Institute of Science and technology)
- 발행 : 2002.08.21
초록
Conductive adhesives are commonly used for the interconnections of fine pitch, small packages like mobile applications. Since conductive particles connect mechanically with contact pads to give somewhat higher contact resistance, a metallurgical interconnection, which provides both fine pitch and low resistance, was studied using silver ball and indium which can be made at low temperatures. The connection resistance of the In-Ag metallurgical interconnection was lower than that of the Ni/Au-Ag mechanical interconnection and the former showed little dependency on the bonding load in contrast to the latter.
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